Onto Innovation Inc. (NYSE: ONTO) shares galloped Tuesday, as the company today announced advances in its product suite for 3D interconnect process control, featuring the new 3Di™ technology on the Dragonfly® G3 system for bump process control in high bandwidth memory (HBM) and advanced logic applications. Additionally, the EchoScan™ system is introduced for detecting voids as small as 1µm in wafer bonding
applications, such as advanced hybrid bonding for Cu-Cu interconnects. Initial orders for the 3Di technology include a top HBM manufacturer, a tier one OSAT and a leading manufacturer of bump process equipment. The first EchoScan system will ship in the first quarter, with additional tools planned to ship to customers throughout 2025.
Advanced packages with 2.5D and 3D integration schemes are projected to grow at a rate of 19% from 2024 through 2028, according to TechInsights. Interconnect bump heights in high volume manufacturing (HVM) are decreasing from 12µm to 8µm, and potentially to 4µm. As bump sizes decrease, metrology and inspection become increasingly critical to ensuring high yields.
According to Mike Rosa, Onto’s chief marketing officer, “Onto designed the 3Di technology to meet customers’ needs for more stable technologies accommodating smaller bump sizes—even below 5µm in HVM and 2µm in R&D—in next generation logic and memory devices.”
ONTO shares jumped $8.37, or 4.4%, to $199.28.
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