IBM (NYSE: IBM) revealed architecture details for the upcoming IBM Telum® II Processor and IBM Spyre™ Accelerator at Hot Chips 2024. The new technologies are designed to significantly scale processing capacity across next generation IBM Z mainframe systems helping accelerate the use of traditional AI models and Large Language AI models in tandem through a new ensemble method of AI.
The processors include: IBM Telum II Processor: Designed to power next-generation IBM Z systems, the new IBM chip features increased frequency, memory capacity, a 40 percent growth in cache and integrated AI accelerator core as well as a coherently attached Data Processing Unit (DPU) versus the first generation Telum chip. The new processor is expected to support enterprise compute solutions for LLMs, servicing the industry's complex transaction needs.
IO acceleration unit: A completely new Data Processing Unit (DPU) on the Telum II processor chip is engineered to accelerate complex IO protocols for networking and storage on the mainframe. The DPU simplifies system operations and can improve key component performance.
IBM Spyre Accelerator: Provides additional AI compute capability to complement the Telum II processor. Working together, the Telum II and Spyre chips form a scalable architecture to support ensemble methods of AI modeling – the practice of combining multiple machine learning or deep learning AI models with encoder LLMs. By leveraging the strengths of each model architecture, ensemble AI may provide more accurate and robust results compared to individual models.
“Big Blue” as it’s called, opened trading in New York up 86 cents to $196.94.
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